Rapid thermal process driven intra-die device variations

  1. Tsai, C.H.
  2. Aboy, M.
  3. Pelaz, L.
  4. Hsu, Y.H.
  5. Woon, W.Y.
  6. Timans, P.J.
  7. Lee, C.K.
Aldizkaria:
Materials Science in Semiconductor Processing

ISSN: 1369-8001

Argitalpen urtea: 2022

Alea: 152

Mota: Artikulua

DOI: 10.1016/J.MSSP.2022.107052 GOOGLE SCHOLAR