Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder

  1. Soares, D.
  2. Vilarinho, C.
  3. Silva, R. F.
  4. Barbosa, J.
  5. Castro Ruiz, Francisco
Aldizkaria:
Revista de metalurgia

ISSN: 0034-8570

Argitalpen urtea: 2005

Alea: 41

Zenbakia: 0

Orrialdeak: 208-212

Mota: Artikulua

DOI: 10.3989/REVMETALM.2005.V41.IEXTRA.1026 DIALNET GOOGLE SCHOLAR lock_openSarbide irekia editor

Beste argitalpen batzuk: Revista de metalurgia