Effect of the bismuth content on the interface reactions between copper substrate and Sn-Zn-Al-Bi lead-free solder

  1. Soares, D.
  2. Vilarinho, C.
  3. Silva, R. F.
  4. Barbosa, J.
  5. Castro Ruiz, Francisco
Revue:
Revista de metalurgia

ISSN: 0034-8570

Année de publication: 2005

Volumen: 41

Número: 0

Pages: 208-212

Type: Article

DOI: 10.3989/REVMETALM.2005.V41.IEXTRA.1026 DIALNET GOOGLE SCHOLAR lock_openAccès ouvert editor

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