Departamento
Electricidad y Electrónica
Artículos (15) Publicaciones en las que ha participado algún/a investigador/a
1997
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A comparative study of time domain techniques in multiexponential fitting
International Journal of Applied Electromagnetics and Mechanics, Vol. 8, Núm. 2, pp. 185-204
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A quick and low noise sensitive technique to fit multiexponential responses
Computational Materials Science, Vol. 7, Núm. 4, pp. 351-360
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An EPR study of the ZnxCd1-XCr2S4 system
Physica Status Solidi (B) Basic Research, Vol. 201, Núm. 2
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B diffusion and clustering in ion implanted Si: The role of B cluster precursors
Applied Physics Letters, Vol. 70, Núm. 17, pp. 2285-2287
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Deep levels in p+-n junctions fabricated by rapid thermal annealing of Mg or Mg/P implanted InP
Journal of Applied Physics, Vol. 81, Núm. 7, pp. 3143-3150
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Detailed electrical characterization of DX centers in Se-doped AlxGa1-xAs
Journal of Applied Physics, Vol. 82, Núm. 9, pp. 4338-4345
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Dose effects on amorphous silicon sputtering by argon ions: A molecular dynamics simulation
Journal of Applied Physics, Vol. 81, Núm. 3, pp. 1488-1494
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Experimental observation of conductance transients in Al/SiNx:H/Si metal-insulator-semiconductor structures
Applied Physics Letters, Vol. 71, Núm. 6, pp. 826-828
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Induction of magnetic accommodation processes in polycrystalline yttrium iron garnet
Journal De Physique. IV : JP, Vol. 7, Núm. 1
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Molecular dynamics simulations of ion bombardment processes
Materials Science and Technology, Vol. 13, Núm. 11, pp. 893-896
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Physical mechanisms of transient enhanced dopant diffusion in ion-implanted silicon
Journal of Applied Physics, Vol. 81, Núm. 9, pp. 6031-6050
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Reduction of transient diffusion from 1-5 keV Si+ ion implantation due to surface annihilation of interstitials
Applied Physics Letters, Vol. 71, Núm. 21, pp. 3141-3143
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The magnetic disaccommodation in titanium doped magnetite
Journal De Physique. IV : JP, Vol. 7, Núm. 1
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Thermal emission processes of DX centres in AlxGa1-xAs:Si
Solid-State Electronics, Vol. 41, Núm. 1, pp. 103-109
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Thin film resistors and capacitors for advanced packaging
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 71-74